Piezoelectric injection valve Quick P3020C
- High-precision piezoelectric dispensing valve for automated deposition/dispensing applications.
- Compact and lightweight design, easy to integrate into production lines.
- Compatible with a wide range of fluid viscosities.
- Optimized for micro-dot dispensing and high-frequency operation.
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Category: Precision dispensing
Overview
P3020C is a high-performance piezoelectric dispensing valve designed for precise fluid deposition in electronics and micro-assembly applications. The valve operates at frequencies up to 1000 Hz, with a minimum dispensing dot size of 0.2 mm. It supports a wide viscosity range from 1 to 200,000 Cps and utilizes corrosion-resistant, high-temperature sealing materials. Its compact design allows easy integration into automated production lines for applications such as underfill, conformal coating, edge/corner bonding, FPC reinforcement, red glue dispensing, and grease application.
Features
- High-frequency operation up to 1000 Hz for fast and precise dispensing.
- Supports micro-dot dispensing with a minimum diameter of 0.2 mm.
- Compatible with a wide viscosity range (1–200,000 Cps).
- Corrosion-resistant and high-temperature sealing materials ensure durable operation.
- Interchangeable needle cylinders available in 10 cc, 30 cc, and 50 cc.
- Compact and lightweight design, easily integrated into automated systems.
- Applications for electronics processes: underfill, encapsulation, conformal coating, dam & fill, edge/corner bonding, surface-mounted packages, FPC reinforcement, red glue dispensing, and grease application.
Specifications
| Specification | P3020C |
|---|---|
| Maximum Operating Frequency | 1000 Hz |
| Minimum Dispense Dot Diameter | 0.2 mm |
| Optimal Viscosity Range | 1–200,000 Cps |
| Overall Dimensions | 77 × 25 × 126 mm |
| Weight | 400 g |
| Needle Cylinder Volume | 10 cc / 30 cc / 50 cc |
| Sealing Material | Corrosion-resistant, high-temperature resistant |
| Maximum Heating Temperature | 20–80 ℃ |
| Typical Fluid Applications | Underfill, encapsulation, conformal coating, dam & fill, edge/corner bonding, surface-mounted packages, FPC reinforcement, red glue dispensing, grease |
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