Laser making

Intelligent anti stupidity and anti re carving

Industry minimum laser spot diameter 0.11mm

Laser stability: fluctuation rate of output power

Customized MES system docking

Upper and lower head / three section varus unit

Self test reading rate: 100%

Laser imported from the United States

High-precision visual navigation system

Light-weight design laser module

Providing high-precision laser marking, coding, and surface-processing solutions designed for electronics manufacturing, SMT components, industrial products, and applications requiring absolute traceability. The systems are engineered for smart operation, long-term stability, and maximum automation, helping increase productivity, reduce human error, and ensure uniform marking quality on all materials.

Key Features of Laser Marking Technology:

  • Smart anti-misoperation & anti-duplicate marking
    AI algorithms detect incorrect operations and prevent repeated marking, minimizing defects on the production line.
  • Ultra-fine 0.11 mm laser spot size
    One of the smallest spot sizes in the industry, enabling exceptionally detailed and sharp marking.
  • High power-stability performance
    Extremely low energy fluctuation ensures consistent marking quality over long-term operation.
  • MES integration on demand
    Supports seamless connectivity and production data synchronization based on factory requirements.
  • Flexible marking head configurations
    Options for top/bottom heads or a three-segment module, compatible with various product types and marking surfaces.
  • 100% reading & verification accuracy
    The system automatically verifies that all codes are successfully readable after marking.
  • U.S.-imported laser source
    High quality, long lifespan, and stable performance.
  • High-precision visual alignment
    Supports automatic positioning to reduce deviation and enhance marking accuracy.
  • Lightweight laser module
    Easy to integrate into automated production lines.
Equipment configuration
Application field

Post package semiconductor engraving

Operating process