Laser making
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Intelligent anti stupidity and anti re carving |
Industry minimum laser spot diameter 0.11mm |
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Laser stability: fluctuation rate of output power |
Customized MES system docking |
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Upper and lower head / three section varus unit |
Self test reading rate: 100% |
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Laser imported from the United States |
High-precision visual navigation system |
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Light-weight design laser module |
Providing high-precision laser marking, coding, and surface-processing solutions designed for electronics manufacturing, SMT components, industrial products, and applications requiring absolute traceability. The systems are engineered for smart operation, long-term stability, and maximum automation, helping increase productivity, reduce human error, and ensure uniform marking quality on all materials.
Key Features of Laser Marking Technology:
- Smart anti-misoperation & anti-duplicate marking
AI algorithms detect incorrect operations and prevent repeated marking, minimizing defects on the production line. - Ultra-fine 0.11 mm laser spot size
One of the smallest spot sizes in the industry, enabling exceptionally detailed and sharp marking. - High power-stability performance
Extremely low energy fluctuation ensures consistent marking quality over long-term operation. - MES integration on demand
Supports seamless connectivity and production data synchronization based on factory requirements. - Flexible marking head configurations
Options for top/bottom heads or a three-segment module, compatible with various product types and marking surfaces. - 100% reading & verification accuracy
The system automatically verifies that all codes are successfully readable after marking. - U.S.-imported laser source
High quality, long lifespan, and stable performance. - High-precision visual alignment
Supports automatic positioning to reduce deviation and enhance marking accuracy. - Lightweight laser module
Easy to integrate into automated production lines.
Double track carving
👉 Direct mount double track
👉 Independent engraving mode
👉 Independent transmission plate
Double sided carving of upper and lower heads
👉 A side and B side are engraved at the same time
👉 100% increase in efficiency
Built-in flap
👉 Double side code printing, front and back flip
👉 Reduce transmission time and improve efficiency by 30%
Minimalist operation interface
👉 Step by step programming step
👉 One click point selection design
👉 Multi module custom barcode editing rules
Post package semiconductor engraving
Operating process
1. Loading machine feeding
2. Feeding into receiving track
3. CCDpositioning / code reading
4. Magnetic levitation platform positioning
5. Transfer the carrier board to the marking position
6. Automated laser marking
7. Base plate cleaning
8. Feeding into receiving track
9. CCD detection and identification
10. Receiving operation of receiving machine