7610 Infrared BGA Rework System

QUICK7610 adopts infrared sensing technology and is controlled by a microprocessor.

Both the infrared temperature sensor and the infrared heating tube operate in a non-contact manner, ensuring highly accurate component removal.

The soldering process is monitored by a non-contact infrared sensor, enabling stable and real-time process control.

To achieve precise, non-destructive, and repeatable PCB temperature control, the QUICK7610 provides a heating power of 2400W, suitable for a wide range of applications including large and small PCBs, and fully compatible with lead-free soldering.

The QUICK7610 uses cycle-controlled reflow heating technology, ensuring a narrow and precise process window, uniform heat distribution, and optimal peak temperature for highly reliable lead-free joints.

1. No nozzle required; no airflow is generated during BGA reballing or rework, improving process success rate.
2. Open-top infrared (top IR) heating combined with large-area bottom IR heating reduces vertical temperature gradients between the BGA surface and solder joints, shortening repair time.
3. Non-contact infrared temperature sensor with full closed-loop control of BGA surface temperature, ensuring accurate thermal profiles and uniform heat distribution.
4. PCB fixture can move in four directions, making installation and adjustment convenient.
5. IRSOFT interface supports operator access control and thermal profile analysis.