7720 Hot Air BGA Rework System

The QUICK7720 BGA Rework Station uses a microprocessor-based controller, enabling precise and safe repair and soldering of BGA, CSP, and other SMT surface-mount components. The entire process can be controlled through the dedicated rework software — BGASoft — which records all process data and meets the high-standard requirements of modern electronics manufacturing. It is one of the most valuable electronic tools in the electronics industry.

The QUICK7720 combines infrared heating and hot-air heating in a well-balanced design. To achieve stable and non-destructive PCB temperature control during soldering, the machine provides an adjustable heating capacity of 3500W. The upper heater uses hot air, while the lower heater combines infrared and hot air. The local bottom hot-air heating focuses on the underside of the BGA area and is controlled by the thermal profile, while the infrared heating covers the entire PCB to control preheating temperature, prevent localized PCB deformation, and ensure uniform heat distribution. This achieves even temperature distribution and the appropriate peak temperature required for highly reliable lead-free soldering.

The system uses a movable frame-style PCB holder, capable of installing support bars for special-shaped PCBs. The lower support bar connects to the crossbar, ensuring consistent PCB placement every time and supporting larger PCB sizes.

Additionally, the system comes with integrated control software and process visualization, allowing multi-level program management. It effectively meets users’ BGA repair requirements and is particularly outstanding in lead-free soldering applications.

1. Integrated design with a high level of intelligent automation.
2. Advanced working principle combining wide-area infrared preheating with targeted bottom hot-air heating.
3. High-quality heating materials ensure excellent soldering/desoldering yield and long-term machine stability.
4. Powerful side cooling fan with adjustable airflow, achieving ideal cooling speed according to process requirements.
5. Controlled through QUICKSOFT software; simple and convenient operation.

The equipment is suitable for soldering, component removal, and rework of packaging types such as BGA, CSP, QFP, PLCC in manufacturing and repairing products including laptops, desktops, servers, industrial control boards, network switches, and more.
Fully compliant with lead-free soldering requirements.