EA-A10 Hot Air BGA Rework System

1. High automation: single-button operation for soldering, repairing, picking, and placing chips; easy to use.
2. High-power brushless DC fan, closed-loop sensor, zero-trigger microprocessor control; provides strong airflow at stable temperature. No external gas source needed; flexible application.
3. Seven temperature zones suitable for reflective BGAs, multi-layer BGAs, metal shielded packages, and POP components.
4. Integrated design: heating and alignment system work in perfect coordination.
5. Two-color optical prism alignment with joystick control for precise positioning.
6. Adjustable horizontal airflow fan; cools bottom heat zones and PCB according to process requirements.
7. QUICKSOFT interface with access rights for operation and profile analysis; allows analysis of preheat speed, peak temperature, soak time, and cooling rate.
8. Multiple interchangeable nozzles.
9. Compatible with desktop motherboards, server motherboards, industrial PCs, terminals, and large PCBs requiring BGA or CONNECT repair.

1. Top and bottom heaters up to 1200W, combined with a brushless fan creating vortex airflow at 60L/min.
2. Wide-area bottom infrared heater meets preheat requirements for large server motherboards and industrial PCs.

Vertical temperature difference control

Horizontal and vertical temperature differences in the soldering zone are optimized for lead-free processes. Thanks to the specially designed hot-air convection system, soldering success rate and quality are ensured.

Horizontal temperature difference control

Uses image-splitting prism for precise component positioning, with independent top and bottom illumination. Combines manual and automatic operation with ±0.02 mm alignment accuracy.

High-resolution autofocus camera with assistive lighting for clear, high-contrast images.

During alignment, fine adjustments along X, Y, Z axes and θ angle can improve alignment efficiency by up to 50%.

1. Heating structure with top, bottom, and middle hot-air zones, combined with bottom dark infrared heater for easy attainment of target thermal profiles.
2. Adapts to various soldering conditions; reduced temperature differential helps achieve higher soldering CPK.

7-level temperature control (D1–D6 + Cool) can simulate an SMT oven thermal profile, achieving optimal process conditions.

The machine can be controlled via PC using BGA SOFT software, allowing thermal profile adjustment, parameter setting, and component height adjustment.

The software also enables analysis of key process parameters including preheat rate, peak temperature, soak time, and cooling rate.