HOANG HA IE – Authorized Representative of QUICK GLOBAL
EA-F16F Auto Solder Removal System
- Non-contact air knife solder removal.
- Stereoscopic reflow heating, safe and reliable.
- Suitable for BGA and POP chip solder removal.
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Features
- Hot-air blade design for side load-bearing axis.
- Multiple options for lead-free hot-air blades.
- Full simulation of top and bottom SMT reflow heating temperature, programmable for adjustment.
- Precise multi-axis robot platform movement; movement positions can be programmed.
- QUICK thermal control system with cycle-based operation, real-time temperature monitoring, safe and efficient.
- Suitable for BGA lead removal, recessed POP lead removal, etc.
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