EA-L20 Laser BGA Rework System

BGA system utilizing laser heating technology.

Working principle: The laser beam, after being expanded, reflected, and focused, acts on the chip surface where heat is accumulated and conducted inward.

By digitally controlling the laser pulse parameters—including pulse width, energy, peak power, and repetition frequency—solder balls and pads are heated to melting and reflow temperatures, enabling precise laser soldering.

The system is especially suitable for mounting and repairing high-density components.

1. Precision soldering with bright, clean solder joints.
2. High soldering speed with low thermal deformation; only heats the targeted component surface, minimizing impact on surrounding components—ideal for high-density soldering areas.
3. Uniform temperature distribution with precise reflow curve control.
4. No need to change the air nozzle; heating profiles are fully programmable.
5. 21.5-inch touchscreen with high-precision stylus support for drawing heating profiles.

Laser-based selective heating zones allow effective control of the solder joint temperatures on the BOTTOM side. This solution is well-suited for various underfill adhesive processes and ensures precise temperature differential control.   Heating zones can be edited precisely, allowing selective heating without causing thermal damage to surrounding components.