R35 Infrared BGA Rework System

Category: BGA rework equipment

Features

Three-zone heating system combining infrared + hot air, using a non-contact infrared sensor for direct chip temperature measurement.
True closed-loop control ensures an accurate thermal window and uniform heat distribution.
High level of automation, enabling one-button chip removal and reballing/replacement.
Independent chip removal and reflow modules for enhanced equipment precision.
Alignment system using high-resolution chromatic optical prisms combined with an HD industrial camera, delivering high alignment accuracy and clarity.
Zero-pressure placement design to prevent chip damage.
Multi-function PCB holder compatible with various support accessories for convenient operation.
High-power horizontal cooling fan with automatic cooling.
Dedicated QUICK BGASOFT software with user permission management, parameter recording, and analysis.
Suitable for desktop motherboard repair, mobile phone motherboards, communication boards, industrial control boards, and 5G server motherboards.

Parameter	Value
Model	QUICK EA-R35
Peak Power	13.5 kW
Power Supply	AC 380V ±10%, 50/60Hz
Upper Infrared Heating Power	1.2 kW
Local Hot-Air Heating Power	1.2 kW
Lower Infrared Heating Power	9.6 kW
PCB Size Range	10 × 10 – 700 × 650 mm
Preheating Area	820 × 570 mm
Chip Size Range	5 × 5 – 65 × 65 mm
Alignment System	Laser indicator + optical prism + HD industrial camera
Placement Pressure	0 / 1.5 N
Placement Accuracy	±0.025 mm
Temperature Control Accuracy	±2 ℃
Temperature Measurement Ports	6 ports
Overall Dimensions	L1500 × W1125 × H1410 mm (excluding monitor stand)
Weight	560 kg