HOANG HA IE – Authorized Representative of QUICK GLOBAL
3000 BGA Re-balling Reflow Machine
- Top and bottom infrared heating with closed-loop temperature control
- 10-stage temperature heating
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Features
- Based on dark infrared heating principles, the device uses closed-loop temperature control to ensure precise, stable temperature with minimal fluctuation. Featuring a dark-infrared ceramic bottom heater and a high-power infrared top heater, the machine offers exceptionally long service life. The design reduces horizontal temperature deviation on BGA components, preventing cold joints or overheating that could damage the chip.
- Equipped with a viewing window that allows direct monitoring of the BGA solder ball reflow process and supports simultaneous soldering of multiple BGA types.
- Integrated audio and visual alarms activate when the heating chamber is opened during operation.
- After the process ends, the cooling fan automatically turns on when the chamber is opened and automatically stops when the chamber is closed.
- The control panel includes an external K-type thermocouple for monitoring the actual BGA temperature.
Specifications
| Specification | Value |
|---|---|
| Model | QUICK 3000 |
| Top heating power | 500W |
| Bottom heating power | 400W |
| Temperature range | 50℃ – 300℃ |
| Process profiles | 10 |
| Heating area size | 130 × 130 mm |
| Overall dimensions | 355 × 225 × 180 mm |
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