HOANG HA IE – Authorized Representative of QUICK GLOBAL
Laser Spray Soldering System LB Series
- Laser Spray Soldering technology using solder balls with no flux required.
- High-precision soldering for micro-components and dense PCB layouts.
- Fast soldering speed with consistent and accurate solder volume.
- Built-in nitrogen generation to minimize oxidation and improve joint quality.
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Overview
QUICK LB Series is a new-generation laser spray soldering system, utilizing solder micro-ball jetting technology combined with high-energy laser heating to create ultra-precise solder joints for micro-components. The LB Series supports multiple configurations from off-line units to fully on-line automation systems, suitable for high-density electronics manufacturing, semiconductor processes, AIoT devices, and industrial applications requiring exceptional stability.
Features
- Laser Spray Soldering technology enables high-precision soldering with spacing as small as 100 μm.
- Supports solder balls from 100–1500 μm with precise control of solder volume for each joint.
- High soldering speed (0.2 s/joint), significantly improving production throughput.
- Flux-free process — leaves no residue, ideal for semiconductor and ultra-clean applications.
- Integrated nitrogen generator reduces oxidation and enhances solder joint quality.
- Multiple Off-line/On-line models with flexible working ranges for different production needs.
Specifications
| Specification | LB10 | LB100 | LB100S | LB1000 |
|---|---|---|---|---|
| Equipment Type | Off-line | Off-line | Off-line | On-line |
| Operation Mode | Single station | Dual asynchronous stations | Dual asynchronous stations | Conveyor-based automated line |
| Overall Dimensions (L×W×H) | 900 × 1100 × 1900 mm (excluding tower light) |
1200 × 1500 × 1750 mm (excluding tower light) |
900 × 1310 × 1750 mm (excluding tower light) |
Customizable |
| Working Area | 220 × 220 mm | 250 × 250 mm | 130 × 130 mm | Customizable |
| Solder Material | Solder balls (diameter 100 μm – 1500 μm) | |||
| Nitrogen Supply Module | Integrated nitrogen generator | |||
| Key Features | Flux-free | Ultra-close soldering (min. 100 μm) | High-speed soldering (0.2 s/joint) | High reliability | Precise solder volume control | |||
| Application Industries | AIoT | Smart Devices | EV | Semiconductor | Aerospace & Industrial | |||
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