BGA Rework System , QUICK EA-H00


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1. The infrared temperature sensor can detect the surface temperature of BGA. So the closed-loop control is realized to provide the even heat distribution to the infrared BGA rework station.
2. To obtain the accurate and correct process curve, the RPC is designed to monitor the melting process of BGA solder ball.
3. The PC is connected to the machine via IRSoft to record and analyze the processing procedure, and to form the curve chart for production.


Power 2400W (Max.)
Bottom Preheating Power 1600W(400W×4, dark infrared heater)
2000W(200W×4, high infrared heating tube, optional)
Power of Top Heater 720W(120W×6, infrared heating tube, wave length: 2-8µm)
Range of Top Heating Area 20-60mm(X, Y adjustable)
Heating Time of Top Heater About 10s (room temperature-230℃)
Range of Bottom Preheating Area 290×290mm
Max. PCB Size 400×400mm
Communication Standard USB (Connected with PC)
Temperature Sensor Non-contact infrared sensor
Movable Motor Step motor
Weight 40kg
Dimension 850(L)×650(W)×730(H)


RPC 22*10 times magnification
Horizontal resolution: 480 lines
PAL format

Note: the motor is not included in this product. Customers can purchase the motor when needed.